SEI High Yield Bond & Alternative Credit ETF (LEND) dividend history and yield
Dividend summary
- Frequency
- Monthly
- Trailing 12 months
- $0.39
- Forward yield
- 1.55%
Dividend history
| Declared | Ex-dividend date | Pay date | Amount |
|---|---|---|---|
| Aug 4, 2026 | Aug 5, 2026 | Aug 6, 2026 | $0.14 |
| Jul 2, 2026 | Jul 6, 2026 | Jul 7, 2026 | $0.25 |
Frequently asked questions
Does SEI High Yield Bond & Alternative Credit ETF (LEND) pay a distribution?
Yes. SEI High Yield Bond & Alternative Credit ETF pays a monthly distribution; the most recent payment was $0.14 per share.
What is LEND's distribution yield?
SEI High Yield Bond & Alternative Credit ETF paid $0.39 per share over the trailing twelve months, a yield of 1.55% at the last price of $24.93.
When is LEND's most recent ex-distribution date?
SEI High Yield Bond & Alternative Credit ETF's most recent ex-distribution date is Aug 5, 2026, payable on Aug 6, 2026.
Dividend amounts and dates are supplied by third parties and may be revised. Declaring, raising, cutting or suspending a dividend is entirely at the issuer’s discretion, and scheduled dates are estimates until declared. A past record of payments does not mean future payments will be made.
This page is for informational purposes only. Nothing on it is a recommendation, solicitation or offer to buy or sell any security, nor investment, legal or tax advice. Light Horse Securities Inc does not verify third-party data and is not responsible for its accuracy, completeness or timeliness.